HIGH TEMPERATURE ELECTRONICS (ELECTRONIC PACKAGING) BY F. PATRICK MCCLUSKEY, THOMAS PODLESAK, RICHARD GRZYBOWSKI
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HIGH TEMPERATURE ELECTRONICS (ELECTRONIC PACKAGING) BY F. PATRICK MCCLUSKEY, THOMAS PODLESAK, RICHARD GRZYBOWSKI PDF
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HIGH TEMPERATURE ELECTRONICS (ELECTRONIC PACKAGING) BY F. PATRICK MCCLUSKEY, THOMAS PODLESAK, RICHARD GRZYBOWSKI PDF
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HIGH TEMPERATURE ELECTRONICS (ELECTRONIC PACKAGING) BY F. PATRICK MCCLUSKEY, THOMAS PODLESAK, RICHARD GRZYBOWSKI PDF
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly. ● ● ● ● ● ● ● ●
Sales Rank: #2143993 in Books Brand: Brand: CRC Press Published on: 1996-12-13 Original language: English Number of items: 1 Dimensions: 10.50" h x 7.50" w x 1.00" l, 1.94 pounds Binding: Hardcover 352 pages
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Used Book in Good Condition
Most helpful customer reviews 0 of 0 people found the following review helpful. Very useful, although dated By Jammer
This book contains a great deal of fundamental information that is as valid today as it was when the book was first published in 1997. It doesn't appear to have been revised since then though, so you'll need to look elsewhere for developments in the last 12 years. 0 of 0 people found the following review helpful. Excellent Handbook By Stephen James As someone new to the field of High Temperature Electronics, this book was of inestimable help to me in coming up to speed rapidly. Using the valuable information provided in this easy to read resource, I was able to complete a system design in rapid time and under budget. I would highly recommend this book to others in this field. 2 of 4 people found the following review helpful. Not worth the cost By A Customer The book appears to be a collection of paragrahps from a myriad sources on the same subject. A very non-scholarly book. See all 4 customer reviews...
HIGH TEMPERATURE ELECTRONICS (ELECTRONIC PACKAGING) BY F. PATRICK MCCLUSKEY, THOMAS PODLESAK, RICHARD GRZYBOWSKI PDF
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