USO0RE43487E

(19) United States (12) Reissued Patent O’Brien et al. (54)

(10) Patent Number: (45) Date of Reissued Patent:

LASER SEGMENTED CUTTING

(58)

Lian-Cheng Zou, Portland, OR (US); Yunlong Sun, Beaverton, OR (US);

Notice:

Field of Classi?cation Search ................ .. 264/400,

(56)

Kevin P. Fahey, Portland, OR (US); Michael J. Wolfe, Portland, OR (US); Brian W. Baird, Oregon City, OR (US); Richard S. Harris, Portland, OR (US)

(73) Assignee: Electro Scienti?c Industries, Inc., Portland, OR (US)

*Jun. 26, 2012

264/157, 158, 163 See application ?le for complete search history.

(75) Inventors: James N. O’Brien, Bend, OR (US);

(*)

US RE43,487 E

References Cited U.S. PATENT DOCUMENTS 4,146,673 A *

3/1979

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(Continued) FOREIGN PATENT DOCUMENTS EP

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(Continued)

This patent is subject to a terminal dis claimer.

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(21) Appl.No.: 12/350,767

U.S. Appl. No. 09/327,722, ?led Jun. 8, 1999. (Earliest possible public availability is believed to be Nov. 1, 2001) (This document is

(22) Filed:

still not available on-line).

Jan. 8, 2009

(Continued)

Related U.S. Patent Documents

Reissue of:

(64) Patent No.: Issued:

6,676,878 Jan. 13, 2004

Appl. No.:

10/165,428

Filed:

Jun. 6, 2002

U.S. Applications: (60)

Division of application No. 11/332,815, ?led on Jan. 13, 2006, noW Pat. No. Re. 43,400, Which is a continu

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ation-in-part of application No. 09/803,382, ?led on Mar. 9, 2001, noW abandoned.

(60)

Provisional application No. 60/297,218, ?led on Jun.

segments (122), from about 10 um to 1 mm. The laser output (32) is scanned Within a ?rst short segment (122) for a pre determined number of passes before being moved to and scanned Within a second short segment (122) for a predeter mined number of passes. The bite siZe, segment siZe (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench back?ll. Real-time monitoring

913, ?led on Sep. 20, 2000.

Int. Cl.

variety of different lasers and Wavelengths. A multi-step pro

on Jan. 31, 2001, provisional application No. 60/233,

(52)

(57) ABSTRACT UV laser cutting throughput through silicon and like materi als is improved by dividing a long cut path (112) into short

is employed to reduce rescanning portions of the cut path [112] (112) Where the cut is already completed. Polarization direction of the laser output (32) is also correlated With the cutting direction to further enhance throughput. This tech

8, 2001, provisional application No. 60/265,556, ?led

(51)

Primary Examiner * Jeffrey Wollschlager (74) Attorney, Agent, or Firm * Stoel Rives LLP

nique can be employed to cut a variety of materials With a

B23K26/04

(2006.01)

0041; 41/91

(2006.01)

cess can optimize the laser processes for each individual

layer.

U.S.Cl. ................. ..264/400;264/482;219/121.62;

219/121.67; 219/121.69; 219/121.8; 219/121.81

45 Claims, 22 Drawing Sheets

12

US RE43,487 E Page 2 US. PATENT DOCUMENTS .

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58888888288 2}

18888; {3382sy 35'1"“ 388888 ' """"""""" "

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*

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31'

'

9/l992 Zappena

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10,2004 Sfk‘ya.

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58828822888 2}

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2888;

al' """"""" " 219/121'69

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5,359,479 A

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EP JP

0818818 A1 57481787

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8888; 8:5?“

FOREIGN PATENT DOCUMENTS V1998 9/1982

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JP

57481787

11/1982

owen .... .. 219/121.66 Leger .............................. .. 372/9

JP JP

58-9782 61486185

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JP JP JP

3-64043 4065154 4-309480

1/1983 8/1986 3/1991

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06-039572

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...... .. 451/5 360/113

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06-23409‘) 11000773

8/1994 1/1999

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219/121.66 65/105 360/103

JP JP JP

11424866 11510740 T 2000164535

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3480807 3180807 11470072

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2/1999 Noddin

W0

WO 97/35811

10/1997

5,870,421 A

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W0

W0 (lo/75983

12/2000

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3/1999

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W0

01-17001

3/2001

5,889,636 A 5,919,329 A *

3/1999 Aryaetal. .. . 360/104 7/1999 Banks et al. ................ .. 156/281

W0 W0

WO 01/52004 A1 WO 02/24396 A1

7/2001 3/2002

5,923,995 A 5,956,382 A *

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W0 W0

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8/2002 1/2003

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2 630013268 A

Schulz ...... ..

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}

ghurch et 31' """""" " 29/407'05

12/1999 Nguyen et a1‘ “

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2/2000 SWenson et al. 2/2000 H8130 6t {11.

2 6,049,056 A

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6,057,180 A

5/2000 Sun etal.

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5/2000 Oshlma er a1

34, IssueNo.4B, pp. 59-60; published Sep. 1, 1991,TDB-ACC-No.

6,069,769 A

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2

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5

Anthony, T.R., “Diodes Formed by Laser Drilling and Diffusion,” J.

gggggg; 51* gggg; 533333333; ~ ~ 3231,55;

53251131358528?85583115513;iiliii‘lhemnonnAppn.

6,356,337 B1

3/2002

°at1°nN°~ PCTMSOZ/Zogm

6 376 797 B1

4/2002 PiWcZyk et a1‘

,

gnu?ziettaall' '

...... .. 438/132

OTHER PUBLICATIONS

“Method of Preventing Damage to Integrated Circuit Chips during

,

1rar

e

_

Zemel .................... .. 355/26

2l9/l2 1'72

_

_

_

_

Internat1onal Search Report andWr1tten Op1n1on concern1ng related

’ ’ 6,400,534 B1

6/2002

6,414,263 B1

7/2002 Uchida et al,

International Search Report, Written Opinion, andInternational Pre

6,420,245 B1 6,423,925 B1

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liminaryEXaminationReportconcerningrelatedInternationalAppli cation NoPcTms01/07661.

Klaassen ..................... .. 360/323

InternationalAPP lication No. PCT?JS02/17908.

US RE43,487 E Page 3 International Search Report and Written Opinion concerning related International Application No. PCT/US02/00867. Cable, Alan; “New Laser Processes and Wavelengths for Drilling Through-Hole and Blind Vias in a Wide range of Circuit Board

Materials,” Proceedings of the Technical Conference IPC Printed Circuits Expo, (Mar. 3, 1996), pp. Sl8-5-l to Sl8-5-9.

Oct. 23, 2009 Of?ce action in Chinese Patent Application No.

2005l0l30l76.X, which generally corresponds to US. Appl. No. l l/332,8l5. Mar. 23, 2010 ?rst Examination Report in German Patent Application No. l02969l3.2-34, Which generally corresponds to US. Pat. No.

6,676,878. Written Opinion concerning corresponding International Applica

Golden, James; “Green Lasers Score Good Marks in Semiconductor

tion No. PCT/US02/ 17908.

Material Processing,” Laser Focus World, vol. 28, No. 6, (Jun. 1, 1992), pp. 75-80.

Written Opinion concerning corresponding International Applica

Jul. 14, 2009 Of?ce action for Japanese Patent Application No. 2003 503392 which corresponds to US. Patent No. 6,676,878.

tion No. PCT/US02/ 00867.

US 6,303,409, 10/2001, Karpman et al. (Withdrawn) * cited by examiner

US. Patent

Jun. 26, 2012

Sheet 1 0f 22

US RE43,487 E

FIG. 1 (PRIOR ART) \_ 8

b

FIG. 2A

1.2

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400

500

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600

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700

800

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FIG. 2B 60 L-

0

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ig 20

v

’ O

0 w

l 400 660 dicing length (mm)

800

1000

US. Patent

Jun. 26, 2012

Sheet 2 or 22

US RE43,487 E

US. Patent

Jun. 26, 2012

Sheet 3 0f 22

US RE43,487 E

US. Patent

Jun. 26, 2012

Sheet 6 0f 22

US RE43,487 E

US. Patent

Jun. 26, 2012

Sheet 7 or 22

US RE43,487 E

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FIG. 20

Jun. 26, 2012

Sheet 11 or 22

US RE43,487 E

)2

US. Patent

Jun. 26, 2012

Sheet 12 or 22

US RE43,487 E

026428 24323239236

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222

FIG. 23 (Prior Art) 214

.

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290

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Jun. 26, 2012

Sheet 13 or 22

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US RE43,487 E

US. Patent

Jun. 26, 2012

Sheet 14 or 22

FIG. 25 (PRIOR ART) 278

270

US RE43,487 E

US. Patent

Jun. 26, 2012

224

Sheet 15 or 22

232 276

276

US RE43,487 E

276

362

US. Patent

Jun. 26, 2012

LT“ EL/VW

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US RE43,487 E

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FIG. 280

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Jun. 26, 2012

Sheet 17 or 22

US RE43,487 E

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Laser segmented cutting

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