USO0RE43605E
(19) United States (12) Reissued Patent O’Brien et al. (54)
(10) Patent Number:
US RE43,605 E
(45) Date of Reissued Patent:
LASER SEGMENTED CUTTING,
(58)
MULTI-STEP CUTTING, OR BOTH
*Aug. 28, 2012
Field Of Classi?cation Search ................ .. 264/400,
264/157, 158, 163 See application ?le for complete search history.
(75) Inventors: James N. O’Brien, Bend, OR (US);
Lian-Cheng Zou, Portland, OR (US); Yunlong Sun, Beaverton, OR (US);
(56)
U.S. PATENT DOCUMENTS
Kevin P. Fahey, Portland, OR (US); Michael J. Wolfe, Portland, OR (US); Brian W. Baird, Oregon City, OR (US); Richard S. Harris, Portland, OR (US)
(73) Assignee: Electro Scienti?c Industries, Inc., Portland, OR (US) (*)
Notice:
4,146,673 A *
FOREIGN PATENT DOCUMENTS EM
Reissue of:
6,676,878 Jan. 13, 2004
Appl. No.:
10/165,428
Filed:
Jun. 6, 2002
U.S. Applications: (60) Division of application No. 11/332,815, ?led on Jan. 13, 2006, Which is a continuation-in-part of applica tion No. 09/803,382, ?led on Mar. 9, 2001, noW aban
doned, said application No. 11/332,815 is a continua tion-in-part of application No. 10/017,497, ?led on Dec. 14, 2001, noW Pat. No. 7,157,038.
(60)
Provisional application No. 60/297,218, ?led on Jun.
8, 2001, provisional application No. 60/265,556, ?led on Jan. 31, 2001, provisional application No. 60/233, (51)
(52)
0706309
4/1996
(Continued) OTHER PUBLICATIONS 200510130176.X, which generally corresponds to U.S. Reissue Divisional U.S. Appl. No. 11/332,815.
(Continued)
Related U.S. Patent Documents
Issued:
Headley ...................... .. 428/335
Oct. 23, 2009 Of?ce action in Chinese Patent Application No.
Jan. 9, 2009
(64) Patent No.:
3/1979
(Continued)
This patent is subject to a terminal dis claimer.
(21) Appl.No.: 12/351,562 (22) Filed:
References Cited
Primary Examiner * Jeffrey Wollschlager (74) Attorney, Agent, or Firm * Stoel Rives LLP
(57) ABSTRACT UV laser cutting throughput through silicon and like materi als is improved by dividing a long cut path (112) into short segments (122), from about 10 pm to 1 mm. The laser output (32) is scanned Within a ?rst short segment (122) for a pre determined number of passes before being moved to and scanned Within a second short segment (122) for a predeter
mined number of passes. The bite siZe, segment siZe (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench back?ll. Real-time monitoring is employed to reduce rescanning portions of the cut path
[112] (112) Where the cut is already completed. Polarization
913, ?led on Sep. 20, 2000.
direction of the laser output (32) is also correlated With the cutting direction to further enhance throughput. This tech
Int. Cl.
variety of different lasers and Wavelengths. A multi-step pro
nique can be employed to cut a variety of materials With a
B23K26/04
(2006.01)
0041; 41/91
(2006.01)
cess can optimize the laser processes for each individual
layer
U.S.Cl. ................. ..264/400;264/482;219/121.62;
219/121.67; 219/121.69; 219/121.8; 219/121.81
17 Claims, 22 Drawing Sheets
12
US RE43,605 E Page 2 U8. PATENT DOCUMENTS 10/1979 Cirri .................... .. 219/121 LM
6,433,301 B1 6’465’158 B1
4,169,976 A
4266 252 A 4,473,737 A
M981 C 1 9/l984 Amer”
4,534,804 A
M985 cadeony """""""" "
45413035 4,547,651 A
219ml LL
6,541,731 B2 6,555,447 B2
4/2003 Meadetal. 4/2003 Weishaussetal. ......... .. 438/460
Mfg/15
6,562,698 B2
5/2003 Manor ........................ .. 438/460
. 219/121 361/414
228583823 B2 6’696’008 5;
138588; 2/2004 Brandi-n er‘
4,589,190 A
5/1986 Anthony
29/571
6,998,571 B2
2/2006 Sekiyaetlal.
4,610,079 A
9/1986 Abe etal.
29/583
7’052’978 B2
500% Shaheen et a1
. 148/187
7’265’034 B2
9/2007 Lu etal
4,618,380 A 4,835,361
A
4839 497 A
4,970,553 A ’
10/1986 Alcorn etal. 5/1989
.................... .. 219/121.85
ll/lggo 0a? “?lial 3/1991
0
A
2001/0034564 A1
1
219M169
Son at”
~~~~~~~~ ~
2/1993
.
Ibaraki
. . . . . . . .
. . . . . . ..
3/1993 N da
5,223,692 A
M993 L". at” ~~~~~~~~~~~~~ ~
’
’
1
7/2001 Hermanetal. ........ .. 219/121.69 10/2001
Jones .......................... .. 700/166
3/2002 Faheyetal. ................. .. 264/400
2004/0188699 A1
9/2004
Kameyama etal.
10/2004 Sekiya
2005/0045090 A1
3/2005
Ikegami-
360/103
219/12169 ~
02“?
4/1994 Cordingley ............ .. 219/121.69
' '
8/2011 Boyle etal.
2002/0033558 A1
2004/0211762 A1
InagaWaetal. ........ .. 219/121.71
5198637 A 5,300,756 A
~
9/1992 Zappella 11/1992
’
7,989,320 B2
2001/0009250 A1 ~
Nakashima ................. .. 360/126
“M991 J hn
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5,151,389 A 5,166,493 A
’
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5057 664 A
5,187,623
snoin
M989 S k
’
5,001,591 A ’
10/1985 9/1985 Maruyama Carlson etal... .
8/2002 Dunsky etal. ......... .. 219/121.67 10/2002 Sek‘ya
-
Zoos/0054179 ‘A1 2005/0260829 A1
30005 Naga‘ 11/2005 Uematsuetal.
2006/0088984 A1
4/2006 Li et al.
5,331,497 A 5,359,479 A
7/1994 10/1994
. . Fuchlgaml .. 360/126 Karam, 11 ................... .. 360/126 .
2006/0154385 A1
2007/0272666 A1 2007/0275541A1
11/2007
5,465,186 A
11/1995 Bajoreketal. .............. .. 360/113
2009/0242525 A1
10/2009 UBrienetal
5,479,308 A
12/1995 Voegelietal.
. 360/113
5,543,365 A
8/1996 Wills et al. ..
437/226
12/1996
Song ...... ..
219/121.62
12/1996 Tachibana 1/1997 owen etal
360/103 219/121.71
EP JP
.. 219/121.66
3/1997
Owen .... ..
5/1997
Leger
A
5,643,472 A 5,699,212 A 5,739,048 A
Harrisetal.
'
5,589,090 A
5,627,847
Aggarwal
FOREIGN PATENT DOCUMENTS
5,590,005 A 5,593,606 A 5,614,114 A
7/2006
. 11/2007 OBrien etal.
0818818 A1 57481787
1/1998 11/1982
JP
58-9782
1/1983
372/9
JP
61486185
8/1986
7/1997 Engelsberg etal. .......... .. 216/65 12/1997 Erpelding etal. .......... .. 360/104 4/1998 Kerth etal. ................. .. 437/226
JP JP JP
3-64043 4065154 4-309480
3/1991 3/1992 11/1992
2/1994
... .... ... ...
. . . ..
5,747,858 A
5/1998 Hawkins
JP
06-039572
5,751,585 A
5/1998 Cutler et al. ........... .. 364/474.03
JP
06-23409‘)
8/1994
5,755,612 A
5/1998 SchaenZeretal. .
JP
06-277861
10/1994
5,757,590 A
5/1998 Phipps et al. .... ..
5,759,428 A
6/1998 Balamane etal.
5,779,753 5,796,549 5,841,099 5,843,363
A A A A
5,847,960 A
451/5 360/113
JP
11000773
1/1999
219/121.66
JP
11424866
8/1999
7/1998 Vetteretal. ............ .. 65/105 8/1998 Sedbrook etal. .. . 360/103 11/1998 owen etal. ...... .. 219/121.69 12/1998 Mitwalsky etal. ...... .. 264/400
JP JP JP JP
115107407 T 2000164535 2000408798 3480807
9/1999 6/2000 7/2000 4/2001
364/474.29
JP
3180807
5,864,430 A
1/1999 Dickey etal. ............... .. 359/559
JP
11470072
6/2006
5,868,950 A
2/1999 Noddin
W0
WO 97/35811
10/1997
5,870,421 A
2/1999 Dahm ........................... .. 372/75
W0
WO 00/73013 A1
12/2000
5,872,684 A
2/1999 Had?eld etal.
. 360/103
W0
WO 00/75983
12/2000
5,883,759 A
3/1999
. 360/104
W0
01-17001
3/2001
5,889,636 A 5,919,329 A * 5,923,995 A
3/1999 Aryaetal. .. 7/1999 Banks et al. 7/1999 Kao etal. ............ ..
. 360/104 . 156/281 438/460
W0 W0 W0
WO 01/52004 A1 WO 02/24396 A1 W0 02/060636 A1
7/2001 3/2002 8/2002
9/1999 Wiener-Avnear etal.
378/98.8
W0
W0 03/002289 A1
1/2003
5,956,382 A 5,963,364 A 5,986,807 A
12/1998 Cutler et al.
Schulz ...... ..
10/1999 Leong etal. ................ .. 359/352 11/1999 Fork ............................ .. 359/569
4/2001
OTHER PUBLICATIONS
2
(8:223:11 et 31' """""" " 29/407'05
Jul. 14,2009 Of?ce actionbyEXaminer KoichiMatsumoto for Japa
6,001,268 A
12/1999 Nguyen et al. ................ .. 216/67
nese Patent Application No. 2003-503392, which corresponds to
8853888 2 ’ ’
58888
6,032,997 A
sl-ao eta' 3/2000 Elliott etal.
6,037,565 A
3/2000 Hackelet a1‘ “
6,049,056 A
4/2000 Balamane etal. ..... .. 219/121.69
6,676,878.
6,057,180 A
5/2000 Sun et al. .................... .. 438/132
US. Appl. No. 09/327,722, ?led Jun. 8, 1999. (Earliest possible
2
8 a1‘
294/64.1
61118818188881‘. """"""" "
630693769 A
50000 D O rius et a1‘
6,130,009 A
100000 Smith et a1‘ '
6,146,813 A
11/2000 Gimrd et a1,
_
P
ortin German PatentA
PP
lication
No. 10296913.2-34, Which generallycorresponds to US. Appl.No.
430/1
430/319
7/2001 Lundquistetal. . 9/2001 Lundquist et 31~ ~
6’400’534 Bl
6/2002 lglgzszslne a‘
gemel
Stillnotavailable °n.'1ine)'
‘ 360/l03
6,255,621 B1 6,288,873 B1
-
US'APPI' NO' 6,676,878 Mar. 23,2010 ?rst Examination Re
public availability is believed to be Nov. 1, 2001) (This document is
5/2000
’
219/121‘73
glomkel
6,066,562 A
’
' 4886688
219/121.72 360/2346
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7/2002 Uchida etal.
6,420,245 B1
7/2002
6,423,925 B1
7/2002 Sukhman eta.
6,430,465 B2
8/2002
Manor ...... ..
.
.
.
Wafer Dicing, IBM Technical Disclosure Bulletin, May 1992, US,
vol. 34, Issue No. 12, pp. 311-312, published May 1, 1992, TDB ACC-NO: NN9205311. Lee, Rex A., et al., “EXcimer vs NDzYAG Laser Creation of Silicon
Vias for 3D Interconnects,” IEEE/CHMT International Electronics
360/3'23
Manufacturing Symposium(1992), pp. 358-360.
438/460
g Y g Ceramic,” IBM Technical Disclosure Bulletin, Se P . 1991, US, vol. 34.IssueN9~4B,PP~59-60;Pub1iShed$ep~ LI99LTDB-ACC-NOI
""""""""""" "
6,414,263 B1
.
“Method of Preventing Damage to Integrated Cl-fCult Chips during
“Creation of an Air Bearin
. 219/121.6
Cutler ......................... .. 700/193
NB910959.
Surfaceb
EXcimer Laser Patternin
of
US RE43,605 E Page 3 Anthony, T.R., “Diodes Formed by Laser Drilling and Diffusion,” J. Appl. Phys., vol. 53 (Dec. 1982), pp. 9154-9164. International Search Report concerning related International Appli cation No. PCT/US02/20826 Jan. 9, 2003.
International Search Report and Written Opinion concerning related International Application No. PCT/U S02/ 17908 Dec. 19, 2002. International Search Report, Written Opinion, and International Pre
Materials,” Proceedings of the Technical Conference IPC Printed Circuits Expo, (Mar. 3, 1996), pp. S18-5-1 to S18-5-9. Golden, James; “Green Lasers Score Good Marks in Semiconductor
Material Processing,” Laser Focus World, vol. 28, No. 6, (Jun. 1, 1992), pp. 75-80.
Written Opinion Concerning corresponding International Applica
liminary Examination Report concerning related International Appli
tion No. PCT/US02/ 17908.
cation No. PCT/US01/07661 Mar. 20, 2003.
Written Opinion concerning corresponding International Applica
International Search Report and Written Opinion concerning related International Application No. PCT/US02/00867 Aug. 8, 2002. Cable, Alan; “New Laser Processes and Wavelengths for Drilling
US 6,303,409, 10/2001, Karpman et al. (Withdrawn)
Through-Hole and Blind Vias in a Wide range of Circuit Board
* cited by examiner
tion No. PCT/US02/ 00867.
US. Patent
Aug. 28, 2012
Sheet 1 0f 22
US RE43,605 E
FIG. 1 (PRIOR ART) \_8
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FIG. 2A 1.2
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US. Patent
Aug. 28, 2012
Sheet 2 0f 22
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 3 0f 22
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US RE43,605 E
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US. Patent
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Aug. 28,2012
Sheet 11 or 22
US RE43,605 E
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Aug. 28,2012
214 220
Sheet 12 or 22
US RE43,605 E
US. Patent
FIG. 24
Aug. 28, 2012
Sheet 13 0f 22
(Prior Art)
US RE43,605 E
US. Patent
Aug. 28,2012
Sheet 14 or 22
FIG. 25 (PRIOR ART) 278
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 15 0f 22
US RE43,605 E
US. Patent
Aug. 28, 2012
Sheet 16 0f 22
US RE43,605 E
FIG. 283 372
370 \
FIG.37228b g,‘ 5:373
212 or 280
FIG. 286
FIG- 28d
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372
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FIG. 289 Km
FIG. 28h 376
373 362 or 364
362 O‘ 364
US. Patent
Aug. 28, 2012
Sheet 17 0f 22
US RE43,605 E
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